Print out each of these sections, put them into a notebook, and bring them to lab each day.

1. standard operating procedures
2. process traveler
3. Mask description and patterns

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1. Lab Computer
2. Furnace controls
3. Filmetrics measurements
4. Four-point probe measurements
5. Microscope / Camera
6. diodes (read first)
7. NMOS
8. BJTs
9. Capacitance meter

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Be sure to look over and understand these materials before performing boron and phosphorus diffusion.

• BN975 source data
• BN975 hydrogen injection process
• Low Temperature Oxidation
• PH950 source data

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Dates for Spring 2021

• Jan 25 – 29
  0. No lab
• Feb 1 – Feb 5
  1. Lab intro and field oxidation.
• Feb 8 – Feb 12
  2. PWELL lithography
• Feb 15 – Feb 19
  3. PWELL deposition
  4. PWELL drive. (Done by lab instructors.)
• Feb 22 – Feb 26
  5. PMOS lithography
• Mar 1 – Mar 5
  6. PMOS deoposition. (Done by lab instructors)
  7. PMOS drive
• Mar 8 – Mar 15
  8. NMOS source/drain lithography
• Mar 15 – Mar 19
  9 & 10. NMOS deposition and drive
• Mar 22 – Mar 26
  11. GATE lithography. (Done by lab instructors.)
  12. GATE oxidation
• Mar 29 – Apr 2
  13 & 14. Contact VIA lithography & metallization
• Apr 5 – Apr 9
  15. METAL contact lithography
• Apr 12 – Apr 23
  16. Device testing | testing check list